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2018.01.09
Cockpit Solution during CES 2018
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Telechips Inc. announced Dolphin+(TCC803x) chipset, their first ever 14nm finFET, SoC for evolutionary cockpit system.
During CES 2018, we are introducing Dolphin+(TCC803x) - processing IVI, Cluster, Head-Up-Display(HUD) and Around-View-Monitor(AVM) in one chipset - for a premium cockpit system at CES2018.
Also, Telechips showcases all-in-one IVI(including Wireless CarPlay)/HUD on Dolphin(TCC802x), cluster/AVM/connectivity(SDL) on TCC897x, entry-level Cluster on TCC892x and low-end car audio solution with connectivity and digital-radio(DAB/DAB+) on Heron(TCC813x).



For more postings, visit
https://www.linkedin.com/feed/update/urn:li:activity:6357138947986034688
https://www.linkedin.com/pulse/telechips-show-off-premium-cockpit-solution-ces-2018-rami-kim/
https://www.facebook.com/telechips.inc/posts/892277884286619
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