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2018.01.09
Telechips, To Introduce Premium Cockpit Solution and Low Power 4K Set Top Box Chipset at CES 2018.
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Telechips, To Introduce Premium Cockpit Solution and Low Power 4K Set Top Box Chipset at CES 2018.

Las Vegas, Jan 9 – Telechips introduces premium cockpit chipset solution and 4K set top box chipset at CES 2018, from Jan 9 to Jan 12, 2018.

Telechips will show off premium cockpit system chipset solution at CES2018. Telechips has been already known as an automotive IVI(in-vehicle infotainment) AP (application processor) company among car OEMs and Tier1s in the automotive industry, and Telechips will transform itself to a cockpit system AP solution company by introducing the Dolphin+ chipset, later this month, the evolutional turnkey cockpit AP which processes IVI, cluster, HUD, and AVM in one chipset.

During the CES 2018, Telechips will show IVI, digital cluster, HUD, and AVM with Dolphin (code name: TCC802x), TCC897x, Heron (code name: TCC813x), and TCC892x chipsets. Telechips infotainment solution highlights Wireless CarPlay which will be provided to Tier1 companies in Korea and mass production in 2018. Telechips is also focusing on digital cluster solution and in a business discussion with Tier1s in Europe and China.

Telechips VP of Automotive Business Unit, Stanley Kim remarked “Customers were impressed when we demonstrated digital cluster by showing 2 second booting with 60fps at 1920x720 wide display which proves CPU and GPU performance.” Telechips also showcases low-end car audio total solution with Heron (code name: TCC813x) which comes with software packages. Telechips is cooperating with global companies to provide connectivity solutions such as Abalta’s Weblink solution and Luxoft’s SDL (Smart Device Link) solution. In addition, Telechips is preparing to provide complete AVM (around view monitor) solution at a competitive price. Dolphin+ will support 4 channels of HD with MIPI interface to realize the AVM, whereas the current chipset Dolphin supports 4 channels of SD resolution.

Telechips also announced that it will exhibit the newest set top box exclusive chipset LION (code name: TCC899x), the smallest and low power consumption AP (Application Processor), at CES 2018. L14nm process is applied on LION chipset, and it minimizes electron transfers, making possible low power consumption and low thermal dissipation.

In addition, Android TV solution is adopted on LION chipset, enabling development of compact and low power consumption products for developers.

Furthermore, NSK solution of CISCO, NOCS 3.1 Anyconnect technology of Nagravision, and Verimatrix Ultra solution of Verimatrix have been deployed by the company, enforcing echo-system with the global top companies.
The LION will be delivered to customers from April, and expecting mass production from Q4, 2018.

About Telechips, Inc.
Telechips, Inc. (KOSDAQ: 054450) is a leader in fabless company fields introducing market leading products. The company designs and builds semiconductor technologies that serve as the foundation for the world's leading application processor and communication ICs for Automotive Infotainment and STB. Telechips is headquartered in South Korea and has regional offices in China, Japan, USA, and Singapore.

Telechips automotive cockpit systems (infotainment, digital cluster, HUD, AVM) have high-security level and power efficiency improving stability of the system. Especially, Telechips not only supplies chipsets, development environment, and reference H/W guide but also provides core technology necessary for developing products.

Telechips’ secure and powerful AP for Android/Linux/HTML5 based STB&OTT, enabling small footprint and low power consumption, benefits users with new experiences and rich multimedia service scenario.

For global marketing, Telechips is cooperating with KOTRA in the World Champ global marketing program as a member of the World Class 300 Company.

Telechips and Telechips logo are either registered trademarks or trademarks of Telechips Inc. and its subsidiaries in the Korea and other countries. All other trademarks mentioned herein are believed to be trademarks of their respective owners.
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