Notice

Telechips BSP listed in MSDN 2010.07.29

Telechips Windows® CE BSP Telechips BSP (Board Support Package) for TCC890x, TCC920x, and TCC910x is listed in the MSDN. Link: http://www.microsoft.com/windowsembedded/en-us/community/bsp.aspx

Microsoft® Windows® Embedded - Gold Partner 2010.07.01

Microsoft Windows Embedded Partner Program (WEPP) Telechips is a Gold Partner of Microsoft® Windows® Embedded Partner Program, in recognition of our expertise in developing, integrating, and marketing Windows® Embedded CE platform. Microsoft® Windows® Embedded Partner Pr..

Telechips at ESEC 2010 in Japan 2010.05.15

ESEC 2010 Telechips exhibited in ESEC 2010. (http://www.esec.jp/en/) Telechips introduced TCC890x, TCC920x, TCC910x, and TCC8000 and demonstrated Networked CE, standalone CE, Automotive solution.

Telechips Solution Seminar 2009 2009.07.16

Telechips Solution Seminar 2009 Telechips held Solution Seminar on 16th of July 2009, at Coex Grand Ball Room. Telechips invited customers in Korea for Telechips solution seminar and demonstration of full HD video, 3D UI, Automotive AVN, and etc. About 300 customers and partn..

Telechips Annual Roadshow during CES 2010 2010.01.11

Telechips Annual Roadshow during CES 2010 During CES 2010 (Jan 7, 2010~ Jan 10, 2010), Telechips held annual roadshow at ARIA hotel in Las Vegas. Telechips demonstrated full HD video, 3D UI, Car AV, Car AVN, MID, eBook, and VoIP integrated into TCC890x, TCC910x, TCC920x, TCC7..

Microsoft® Windows® Embedded - Silver Partner 2009.07.21

Microsoft® WEPP Silver Partner in recognition of expertise in Windows® CE Telechips participates in the Microsoft® Windows® Embedded Partner Program, a worldwide program that reaches the Windows® embedded development community. Telechips became a ‘Silver Partner,’ in rec..

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